Thermal Grease Paste TG-A7000 1KG for CPU Heat Transfers etc

Description

Specification:
Thermal Conductivity: 7.0 W/mK
Viscosity: 2,000~3,000 Pa·s
Density: 35 g/cm³
Working Temperature: -50~180°C
Volume Resistance: 1x10^13
*Syringe should be used with glue gun
Application:
Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless Hub, DDR ll Module, etc.
Features:
Silicone-type spacer with great long term reliability
Lower thermal resistance than thermal pads
Physical property between liquid and solid state
Elimination of different gap between heat source and the heatsink
Can applied with dispenser
Storage:
Store in a cool, dry place away from direct sunlight.